InteliSpark client, Mosaic Microsystems LLC., is awarded a research grant from the National Science Foundation (NSF) for Phase II of their project to develop a packaging platform for the next generation communications electronics such as 5G wireless applications.
The tech industry is constantly evolving to produce higher performance technologies. In particular, the microelectronics industry is always looking for innovative technologies to create devices that are smaller, more power efficient, and lightweight. With the emergence of 5G, power loss is a major concern.
Mosaic Microsystems is addressing this issue through their innovative packaging technology based on their novel thin glass technology. Researchers have successfully advanced to Phase II NSF funding, demonstrating great promise in their technology to improve power efficiency and enable faster communications. The new packaging platform has the possibility for broad commercial and defense applications such as, but not limited to, mobile devices and infrastructure, automotive radar, and internet of things.